Methods and apparatuses for determining threshold voltage shift

ABSTRACT

Apparatuses and methods for determining threshold voltage shift are described. A number of methods for determining threshold voltage shift in memory cells include determining changes in threshold voltage for memory cells at each data state of a first number of data states by searching threshold voltage data of memory cells programmed to the first number of data states and determining changes in threshold voltage for memory cells at each data state of a second number of data states by searching threshold voltage data of memory cells programmed to the second number of data states within a range of threshold voltages, wherein the range is shifted from a previous range based on the changes in threshold voltage for memory cells programmed to the first number of data states.

PRIORITY INFORMATION

This application is a Continuation of U.S. application Ser. No.13/335,309, filed Dec. 22, 2011, which will issue as U.S. Pat. No.8,797,805 on Aug. 5, 2014, which is incorporated by reference.

TECHNICAL FIELD

The present disclosure relates generally to semiconductor memory andmethods, and more particularly, to methods and apparatuses fordetermining threshold voltage shift.

BACKGROUND

Memory devices are typically provided as internal, semiconductor,integrated circuits and/or external removable devices in computers orother electronic devices. There are many different types of memoryincluding random-access memory (RAM), read only memory (ROM), dynamicrandom access memory (DRAM), synchronous dynamic random access memory(SDRAM), phase change random access memory (PCRAM), and flash memory,among others.

Flash memory devices can be utilized as non-volatile memory for a widerange of electronic applications. Flash memory devices typically use aone-transistor memory cell that allows for high memory densities, highreliability, and low power consumption. Uses for flash memory includememory for solid state drives (SSDs), personal computers, personaldigital assistants (PDAs), digital cameras, cellular telephones,portable music players, e.g., MP3 players, and movie players, amongother electronic devices.

Two common types of flash memory array architectures are the “NAND” and“NOR” architectures, so called for the logical form in which the basicmemory cell configuration of each is arranged. A NAND array architecturearranges its array of memory cells in a matrix such that the controlgates of each memory cell in a “row” of the array are coupled to (and insome cases form) an access line, which is commonly referred to in theart as a “word line”. However each memory cell is not directly coupledto a data line (which is commonly referred to as a bit line, in the art)by its drain. Instead, the memory cells of the array are coupledtogether in series, source to drain, between a common source and a dataline, where the memory cells commonly coupled to a particular data lineare referred to as a “column”.

Memory cells in a NAND array architecture can be programmed to atargeted, e.g., desired, data state. For example, electric charge can beplaced on or removed from a charge storage structure, e.g., a floatinggate or charge trap, of a memory cell to put the cell into one of anumber of data states. As memory cells are erased and programmed anumber of times, the amount of electric charge stored by a cell canincrease from the desired amount of electric charge stored by a cell fora particular data state. As memory cells remain static, the amount ofelectric charge stored by a cell can decrease from the desired amount ofelectric charge stored by a cell for a particular data state. Theincrease and/or decrease of electric charge stored by a cell from theamount of desired electric charge stored by a cell can cause errors whensensing a cell using sensing signals that are based on the desiredelectric charge stored by a cell.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic of a portion of an apparatus in the form of anon-volatile memory array in accordance with a number of embodiments ofthe present disclosure.

FIGS. 2A-2C are diagrams illustrating a number of threshold voltagedistributions corresponding to data states associated with memory cellsprogrammed in accordance with a number of embodiments of the presentdisclosure.

FIG. 3 illustrates a method flow diagram for determining thresholdvoltage shift in a memory device in accordance with a number ofembodiments of the present disclosure.

FIG. 4 is a functional block diagram of an apparatus in the form of amemory system including at least one memory device in accordance with anumber of embodiments of the present disclosure.

DETAILED DESCRIPTION

The present disclosure includes apparatuses and methods for determiningthreshold voltage shift. A number of methods for determining thresholdvoltage shift in memory cells include determining changes in thresholdvoltage for memory cells at each data state of a first number of datastates by searching threshold voltage data of memory cells programmed tothe first number of data states and determining changes in thresholdvoltage for memory cells at each data state of a second number of datastates by searching threshold voltage data of memory cells programmed tothe second number of data states within a range of threshold voltages,wherein the range is shifted from a previous range based on the changesin threshold voltage for memory cells programmed to the first number ofdata states.

In the following detailed description of the present disclosure,reference is made to the accompanying drawings that form a part hereof,and in which is shown by way of illustration how a number of embodimentsof the disclosure may be practiced. These embodiments are described insufficient detail to enable those of ordinary skill in the art topractice the embodiments of this disclosure, and it is to be understoodthat other embodiments may be utilized and that process, electrical,and/or structural changes may be made without departing from the scopeof the present disclosure.

As used herein, the designators “N” and “M”, particularly with respectto reference numerals in the drawings, indicates that a number of theparticular feature so designated can be included with a number ofembodiments of the present disclosure. Additionally, as used herein, “anumber of” something can refer to one or more of such things. Forexample, a number of memory devices can refer to one or more memorydevices.

The figures herein follow a numbering convention in which the firstdigit or digits correspond to the drawing figure number and theremaining digits identify an element or component in the drawing.Similar elements or components between different figures may beidentified by the use of similar digits. For example, 100 may referenceelement “00” in FIG. 1, and a similar element may be referenced as 400in FIG. 4. As will be appreciated, elements shown in the variousembodiments herein can be added, exchanged, and/or eliminated so as toprovide a number of additional embodiments of the present disclosure. Inaddition, as will be appreciated, the proportion and the relative scaleof the elements provided in the figures are intended to illustrate theembodiments of the present invention, and should not be taken in alimiting sense.

FIG. 1 is a schematic of a portion of an apparatus in the form of anon-volatile memory array 100 in accordance with a number of embodimentsof the present disclosure. The embodiment of FIG. 1 illustrates a NANDarchitecture non-volatile memory array. However, embodiments describedherein are not limited to this example. As shown in FIG. 1, the memoryarray 100 includes access lines, e.g., word lines 105-1, . . . , 105-Nand intersecting data lines, e.g., local bit lines 107-1, 107-2, 107-3,. . . , 107-M. For ease of addressing in the digital environment, thenumber of word lines 105-1, . . . , 105-N and the number of local bitlines 107-1, 107-2, 107-3, . . . , 107-M can be some power of two, e.g.,256 word lines by 4,096 bit lines.

Memory array 100 includes NAND strings 109-1, 109-2, 109-3, . . . ,109-M. Each NAND string includes non-volatile memory cells 111-1, . . ., 111-N, each communicatively coupled to a respective word line 105-1, .. . , 105-N. Each NAND string (and its constituent memory cells) is alsoassociated with a local bit line 107-1, 107-2, 107-3, . . . , 107-M. Thememory cells 111-1, . . . , 111-N of each NAND string 109-1, 109-2,109-3, . . . , 109-M are connected in series source to drain between asource select gate (SGS), e.g., a field-effect transistor (FET) 113, anda drain select gate (SGD), e.g., FET 119. Each source select gate 113 isconfigured to selectively couple a respective NAND string to a commonsource 123 responsive to a signal on source select line 117, while eachdrain select gate 119 is configured to selectively couple a respectiveNAND string to a respective bit line responsive to a signal on drainselect line 115.

As shown in the embodiment illustrated in FIG. 1, a source of sourceselect gate 113 is connected to a common source line 123. The drain ofsource select gate 113 is connected to the source of the memory cell111-1 of the corresponding NAND string 109-1. The drain of drain selectgate 119 is connected to bit line 107-1 of the corresponding NAND string109-1 at drain contact 121-1. The source of drain select gate 119 isconnected to the drain of the last memory cell 111-N, e.g., afloating-gate transistor, of the corresponding NAND string 109-1.

In a number of embodiments, construction of the non-volatile memorycells 111-1, . . . , 111-N includes a source, a drain, a floating gateor other charge storage structure, and a control gate. The memory cells111-1, . . . , 111-N have their control gates coupled to a word line,105-1, . . . , 105-N, respectively. A NOR array architecture would besimilarly laid out, except that the string of memory cells would becoupled in parallel between the select gates.

As one of ordinary skill in the art will appreciate, a number, e.g., asubset or all, of cells coupled to a selected word line, e.g., 105-1, .. . , 105-N, can be programmed and/or sensed, e.g., read, together as agroup. A number of cells programmed and/or sensed together cancorrespond to a page of data. In association with a sensing operation, anumber of cells coupled to a particular word line and programmedtogether to respective data states can be referred to as a target page.A programming operation, e.g., a write operation, can include applying anumber of program pulses, e.g., 16V-20V, to a selected word line inorder to increase the threshold voltage (Vt) of selected cells coupledto that selected access line to a desired program voltage levelcorresponding to a targeted data state.

A sensing operation, such as a read or program verify operation, caninclude sensing a voltage and/or current change of a bit line coupled toa selected cell in order to determine the data state of the selectedcell. The sensing operation can include precharging a bit line andsensing the discharge when a selected cell begins to conduct.

Sensing the data state of a selected cell can include providing a numberof sensing signals, e.g., read voltages, to a selected word line whileproviding a number of voltages, e.g., read pass voltages, to the wordlines coupled to the unselected cells of the string sufficient to placethe unselected cells in a conducting state independent of the thresholdvoltage of the unselected cells. The bit line corresponding to theselected cell being read and/or verified can be sensed to determinewhether or not the selected cell conducts in response to the particularsensing signal applied to the selected word line. For example, the datastate of a selected cell can be determined by the word line voltage atwhich the bit line current reaches a particular reference currentassociated with a particular state.

As one of ordinary skill in the art will appreciate, in a sensingoperation performed on a selected memory cell in a NAND string, theunselected memory cells of the string are biased so as to be in aconducting state. In such a sensing operation, the data state of theselected cell can be determined based on the current and/or voltagesensed on the bit line corresponding to the string. For instance, thedata state of the selected cell can be determined based on whether thebit line current changes by a particular amount or reaches a particularlevel in a given time period.

As an example, the memory cells of an array such as array 100 can besingle level cells (SLCs) or multi-level cells (MLCs). SLCs can besingle-bit, e.g., two-state, memory cells. That is, the cells can beprogrammed to one of two data states, e.g., L0 and L1, respectively. Inoperation, a number of memory cells, such as in a selected block, can beprogrammed such that they have a Vt level corresponding to either L0 orL1. As an example, data state L0 can represent a stored data value suchas binary “1”. Data state L1 can represent a stored data value such asbinary “0”.

MLCs can be two-bit, e.g., four-state; 2.25-bit, e.g., five-state;2.5-bit, e.g., six-state; 2.75-bit, e.g., seven-state; three-bit, e.g.,eight-state; or four-bit, e.g., sixteen state, memory cells, among othernumber of bits. For example, the cells can be programmed to one of fourdata states, e.g., L0, L1, L2, and L3, respectively, in a two-bit memorycell. In operation, a number of memory cells, such as in a selectedblock, can be programmed such that they have a Vt level corresponding toeither L0, L1, L2, or L3. As an example, data state L0 can represent astored data value such as binary “11”. Data state L1 can represent astored data value such as binary “10”. Data state L2 can represent astored data value such as binary “00”. Data state L3 can represent astored data value such as binary “01”. However, embodiments are notlimited to these data assignments.

FIGS. 2A-2C are diagrams illustrating a number of threshold voltagedistributions corresponding to data states associated with memory cellsprogrammed in accordance with a number of embodiments of the presentdisclosure. The memory cells associated with FIGS. 2A-2C can be memorycells such as cells 111-1, . . . , 111-N described in connection withFIG. 1. The memory cells associated with FIGS. 2A-2C are two-bit, e.g.,four-state, MLCs. However, embodiments of the present disclosure are notlimited to this example.

The Vt distributions 220-1, 222-1, 224-1, and 226-1 of FIG. 2Acorrespond to a number of memory cells programmed to one of four datastates, e.g., L0, L1, L2, or L3. The Vt distributions 220-2, 222-2,224-2, and 226-2 of FIG. 2B correspond to the number of memory cellsassociated with FIG. 2A after a number of cycling operations, e.g.,program/erase cycles, have shifted the Vt distributions. The Vtdistributions 220-3, 222-3, 224-3, and 226-3 of FIG. 2C correspond tothe number of memory cells associated with FIG. 2A after the Vtdistributions have shifted due to data states of the memory cellsremaining static, e.g., the memory cells remain at a data state for aperiod of time.

In FIG. 2A, threshold voltage distributions 220-1, 222-1, 224-1, and226-1 correspond to a number of memory cells that are initiallyprogrammed to a first, a second, a third, or a fourth data state, e.g.,L0, L1, L2, or L3. In a number of embodiments, additional programmingand/or erasing of the number of memory cells can cause the thresholdvoltages for memory cells at the four data states to change asillustrated in FIG. 2B by threshold voltage distributions 220-2, 222-2,224-2, and 226-2. For example, memory cells programmed to the first datastate are illustrated by the L0′ threshold distribution 220-2 and thethreshold voltage distribution has shifted by an amount indicated byshift 230-1, memory cells programmed to the second data state areillustrated by the L1′ threshold distribution 222-2 and the thresholdvoltage distribution has shifted by an amount indicated by shift 232-1,memory cells programmed to the third data state are illustrated by theL2′ threshold distribution 224-2 and the threshold voltage distributionhas shifted by an amount indicated by shift 234-1, and memory cellsprogrammed to the fourth data state are illustrated by the L3′ thresholddistribution 226-2 and the threshold voltage distribution has shifted byan amount indicated by shift 236-1. In a number of embodiments, datastates closer to an erased state, such as L0, can shift less than datastates that are further from the erased state. The shifts in thethreshold distributions 230-1, 232-1, 234-1, and 236-1 can be caused byadditional program and/or erase cycles performed on the number of memorycells.

In a number of embodiments, data states of the memory cells remainingstatic can cause the threshold voltages for memory cells at the fourdata states to change as illustrated in FIG. 2C by threshold voltagedistributions 220-3, 222-3, 224-3, and 226-3. The memory cells can losecharge over time when the data states of the memory cells remain staticcausing the threshold voltage of the memory cells to shift towards 0volts. For example, memory cells programmed to the first data state areillustrated by the L0″ threshold distribution 220-3 and the thresholdvoltage distribution has shifted by an amount indicated by shift 230-2,memory cells programmed to the second data state are illustrated by theL1″ threshold distribution 222-3 and the threshold voltage distributionhas shifted by an amount indicated by shift 232-2, memory cellsprogrammed to the third data state are illustrated by the L2″ thresholddistribution 224-3 and the threshold voltage distribution has shifted byan amount indicated by shift 234-2, and memory cells programmed to thefourth data state are illustrated by the L3″ threshold distribution226-3 and the threshold voltage distribution has shifted by an amountindicated by shift 236-2. The shifts in the threshold distributions230-2, 232-2, 234-2, and 236-2 can be caused by charge loss in thememory cells while they are retained at a data state without additionalprogram cycles being performed on the memory cells.

In a number of embodiments, threshold voltage data can be acquired fromhard and/or soft data associated with a number of memory cells. The hardand/or soft data associated with a number of memory cells can bedetermined via sensing operations on the number of memory cells. Thedata acquired during the sensing operations can be stored in memorycells on an array of memory cells that includes the memory cells thatwere sensed to acquire the data and/or another memory device that doesnot include the memory cells that were sensed to acquire the data.

In a number of embodiments, threshold voltage data that is used to formthe voltage threshold distributions can be searched to determine changesin threshold voltages for memory cells at each data state of a number ofdata states. In a number of embodiments, the changes in thresholdvoltages can be a change in average threshold voltage for each datastate of the number of data states. In a number of embodiments, thechanges in threshold voltages can be a change in the threshold voltagewhere a threshold voltage distribution of each data state of the numberdata states intersects a threshold voltage distribution of an adjacentdata state. For example, when threshold voltage distributions becomecloser to together and overlap due to charge loss and/or a reduction inthe programming window of memory cells, threshold voltage distributionsfor adjacent data states can intersect. In a number of embodiments, thechanges in threshold voltages that are determined for each data statecan be used in further processing of the data associated with each datastate, e.g., the hard and/or soft data associated with each data state.For example, the changes in threshold voltages that are determined foreach data state can be used to make projections on distributionsstatistics for each data state.

In a number of embodiments, threshold voltage data can include currentand prior threshold voltage data for memory cells programmed to a numberof data states. When searching the threshold voltage data, each datastate of a number of data states can be associated with a search range.The search range associated with each data state can define the range ofthreshold voltages searched within the threshold voltage data todetermine the number of memory cells programmed to a particular datastate. For example, the search range associated with the first datastate, L0, can be 0.5 volts. Therefore, when searching for thresholdvoltage data associated with the first data state, threshold voltagedata for memory cells having threshold voltages between −0.8 and −0.3volts is searched.

In a number of embodiments, threshold voltage data can be searchedwithin the search range associated with each data state of a number ofdata states to determine changes in threshold voltages from previousthreshold voltages for memory cells programmed to each data state of thenumber of data states. For example, shift 230-1 for memory cellsprogrammed to the first data state L0 can be determined by searchingthreshold voltage data within the search range associated with the firstdata state. The threshold voltage data having threshold voltages between−0.8 and −0.3 volts can be searched to determine that the averagethreshold voltage for memory cells at the first data state has shiftedby an amount 230-1, such as 0.05 V, for example.

In a number of embodiments, the search ranges associated with each datastate of the number of data states can be adjusted based on changes inthreshold voltage for memory cells programmed to a number of data statesthat were previously determined using the search ranges associated withthe number of data states. The search range associated with a data statecan be adjusted based on an average change in threshold voltage for anumber of data states, a linear extrapolation of the change in thresholdvoltage for a number of data states, and/or data in a table thatindicates the change in threshold voltage for a number of data states.For example, the search range associated with the second data state L1and used to determine shift 232-1 can be adjusted based on shift 230-1that was determined using the search range associated with the firstdata state L0. For example, the second data state having a search rangeof 0.5 volts would search threshold voltage data for memory cells havingthreshold voltages of 0.4 to 0.9 volts. The search range can be shifted0.05 volts to search threshold voltage data for memory cells havingthreshold voltages of 0.45 to 0.95 volts based on the shift of thethreshold voltage of the memory cells at the first program state. Thesearch range associated with the third data state L2 and used todetermine shift 234-1 can be adjusted based on shift 230-1, that wasdetermined using the search range associated with the first data stateL0, and shift 232-1, that was determined using the adjusted search rangeassociated with the second data state L1. The adjustment made to thesearch range associated with the third data state L2 can be based on theaverage of shift 230-1 and 232-1, a linear extrapolation of shift 230-1and shift 232-1, or based on a table having data indicating shift 230-1and shift 232-1.

In a number of embodiments, threshold voltage data for memory cellsprogrammed to a number of data states can be searched within an initialsearch range for each data state of a first number of data states. Forexample, the initial search range can include a range of +/−0.25 voltfrom the desired threshold voltage for each data state of the firstnumber of data states. The change in threshold voltages for each datastate of the first number of data states can be determined whensearching the threshold voltage data within the initial search rangeassociated with each data state. The change in threshold voltages foreach of the first number of data states can be used to adjust a searchrange associated with each data state of a second number of data states.For example, the search range for each data state can be adjusted toinclude a range of −0.2 to +0.3 volts from the desired threshold voltagefor each data state of the second number data states. In a number ofembodiments, the search range for each data state can be adjustedindependently for each of the number of data states.

In a number of embodiments, the data states associated with an array ofmemory cells can be grouped together into a number of groups of datastates. The change in threshold voltages for a first number of datastates determined by searching threshold voltage data can be used toshift a search range for searching threshold voltage data to determinethe change in threshold voltages for a second number of data states. Asused herein, “first” and “second” are only used to distinguish one groupof data states from another, and should not be read to imply anyparticular order or number of data states. Then, the change in thresholdvoltages for the second number of data states can be used to shift asearch range for searching threshold voltage data to determine thechange in threshold voltages for a third number of data states. Thisprocess can be used to determine a change in threshold voltages and ashift of the search range for searching threshold voltage data for eachdata state of a number of groups of data states. For example, a firstnumber of data states can include a first, a second, a third, and afourth data state. A second number of data states can include a fifthand a sixth data state and a third number of data states can includes aseventh and an eighth data state. In another example, a first number ofdata states can include a first, a second, and a third data state. Asecond number of data states can include a fourth, a fifth, and a sixthdata state and a third number of data states can includes a seventh andan eighth data state. In a number of embodiments, each group of a numberof data states can include various numbers of data states. The number ofdata states grouped together can be adjusted so that the number of datastates can be used to sufficiently shift a search range for searchingthreshold voltage data for subsequent data states, e.g., the searchrange is shifted so that the threshold voltage data searched includesthreshold voltage data for the subsequent data states.

FIG. 3 illustrates a method flow diagram for determining thresholdvoltage shift in a memory device in accordance with a number ofembodiments of the present disclosure. At step 350, current and priorthreshold voltage data for memory cells programmed to a number of datastates is acquired. Threshold voltage data can be acquired from softdata associated with memory cells stored in a location in a memoryapparatus, among other locations. The threshold voltage data acquired instep 350 is used to determine current and prior threshold voltagedistributions for memory cells programmed to a number of data states atstep 352.

At step 354, threshold voltage data forming the threshold voltagedistributions is searched within a search range of threshold voltagesassociated with each data state of a number of data states. At step 356,changes in threshold voltages of memory cells programmed to each datastate of the number of data states are determined, along with theaverage threshold voltage for each programs state and/or the thresholdvoltage where the threshold voltage distributions of each data stateintersect with an adjacent data state. The changes in threshold voltagesof memory cells programmed to each data state of the number of datastates are determined via the search of the threshold voltage data. Atstep 357, an estimate of a change in threshold voltages of memory cellsprogrammed to each data state of subsequent data states is determinedbased on the changes in threshold voltages of memory cells programmed toeach data state of the number of data states. At step 358, the estimateof the change in threshold voltages of memory cells programmed to eachdata state of subsequent data states, which is based on the changes inthreshold voltages of memory cells programmed to each data state of thenumber of data states, is used to adjust the search ranges used whensearching the threshold voltage data associated with subsequent datastates, such as in step 354. The changes in threshold voltages of memorycells programmed to each data state of the number of data statesdetermined in step 356 can be used to estimate the change in thresholdvoltages of memory cells programmed to each data state of subsequentdata state and adjust search ranges because data states can shift insimilar manners, therefore changes in threshold voltages for some datastates can be used to approximate, e.g., estimate and/or predict, whereto search for the threshold voltages of memory cells programmed to otherdata states.

In a number of embodiments, the threshold voltage shifts that aredetermined in step 358 can be used to shift the sensing signals that areused during a sensing operation on the number of memory cells. Asthreshold voltages associated with data states shift, the sensingsignals associated with the data states may also be shifted to avoiderrors in the sensing operation. The sensing signals associated with thedata states can be shifted to reduce sensing operation errors. Thesensing signals can be shifted such that shifted sensing signals arebetween two adjacent threshold voltage distributions that have shiftedand/or the intersection of adjacent threshold voltage distributions thathave shifted.

FIG. 4 is a functional block diagram of an apparatus in the form of amemory system including at least one memory device 403 in accordancewith a number of embodiments of the present disclosure. As shown in FIG.4, memory device 403 includes memory array 400. Memory array 400 can be,for example, memory array 100 previously described in connection withFIG. 1. Memory array 400 can include, for example, single level memorycells (SLCs) and/or multilevel memory cells (MLCs). In a number ofembodiments, memory array 400 may not include reference memory cells,e.g., memory array 400 may include only data memory cells. In a numberof embodiments, a memory system can be coupled to a host (not shown inFIG. 4), as part of a computing system. In a number of embodiments, anapparatus can be a memory array, a memory device, and/or a system, suchas a memory system and/or a computing system.

As shown in FIG. 4, memory device 403 also includes controller 462coupled to memory array 400. The controller 462 includes sense circuitry464. Controller 462 can determine changes in the threshold voltages(Vts), e.g., Vt distributions, Vt levels such as mean Vt levels, and/orVt distribution widths, associated with the memory cells in memory array400 via threshold voltage data that can be stored in the memory array400, among other locations. The threshold voltage data in memory array400 can include soft data. Controller 462 can then adjust, e.g., change,sensing signals associated with sense circuitry 464 to sense a state ofthe memory cells based on the determined Vt changes. Sense circuitry 464can then sense a state of the memory cells in memory array 400 using theadjusted Vts. That is, controller 462 can compensate for Vt changes inthe memory cells in memory array 400.

The embodiment illustrated in FIG. 4 can include additional circuitrythat is not illustrated so as not to obscure embodiments of the presentdisclosure. For example, memory device 403 can include address circuitryto latch address signals provided over I/O connectors through I/Ocircuitry. Address signals can be received and decoded by a row decoderand a column decoder, to access memory array 400. It will be appreciatedby those skilled in the art that the number of address input connectorscan depend on the density and architecture of memory device 403 and/ormemory array 400.

CONCLUSION

The present disclosure includes apparatuses and methods for determiningthreshold voltage shift. A number of methods for determining thresholdvoltage shift in memory cells include determining changes in thresholdvoltage for memory cells at each data state of a first number of datastates by searching threshold voltage data of memory cells programmed tothe first number of data states and determining changes in thresholdvoltage for memory cells at each data state of a second number of datastates by searching threshold voltage data of memory cells programmed tothe second number of data states within a range of threshold voltages,wherein the range is shifted from a previous range based on the changesin threshold voltage for memory cells programmed to the first number ofdata states.

Although specific embodiments have been illustrated and describedherein, those of ordinary skill in the art will appreciate that anarrangement calculated to achieve the same results can be substitutedfor the specific embodiments shown. This disclosure is intended to coveradaptations or variations of a number of embodiments of the presentdisclosure. It is to be understood that the above description has beenmade in an illustrative fashion, and not a restrictive one. Combinationof the above embodiments, and other embodiments not specificallydescribed herein will be apparent to those of skill in the art uponreviewing the above description. The scope of a number of embodiments ofthe present disclosure includes other applications in which the abovestructures and methods are used. Therefore, the scope of a number ofembodiments of the present disclosure should be determined withreference to the appended claims, along with the full range ofequivalents to which such claims are entitled.

In the foregoing Detailed Description, some features are groupedtogether in a single embodiment for the purpose of streamlining thedisclosure. This method of disclosure is not to be interpreted asreflecting an intention that the disclosed embodiments of the presentdisclosure have to use more features than are expressly recited in eachclaim. Rather, as the following claims reflect, inventive subject matterlies in less than all features of a single disclosed embodiment. Thus,the following claims are hereby incorporated into the DetailedDescription, with each claim standing on its own as a separateembodiment.

What is claimed is:
 1. A method for determining threshold voltage shiftin memory cells, comprising: determining changes in threshold voltagefor memory cells at a first data state by searching threshold voltagedata of memory cells programmed to the first data state having thresholdvoltages within a first range of threshold voltages; and determiningchanges in threshold voltage for memory cells at a second data state bysearching threshold voltage data of memory cells programmed to thesecond data state having threshold voltages within a second range ofthreshold voltages, wherein the second range is shifted from a previousrange based on the changes in threshold voltage for memory cellsprogrammed to the first data state, wherein the first data state isdifferent than the second data state.
 2. The method of claim 1, whereinthe second range is shifted based on a linear extrapolation of thechanges in threshold voltage for memory cells at the first data state.3. The method of claim 1, wherein the second range is shifted based onan average change of the changes in threshold voltage for memory cellsat the first data state.
 4. The method of claim 1, wherein the secondrange is shifted based on a table indicating the changes in thresholdvoltage for memory cells at the first data state.
 5. The method of claim1, wherein determining the changes in threshold voltage for memory cellsat the first data state includes determining a change in averagethreshold voltage for the first data state using a controller in amemory device.
 6. The method of claim 1, wherein determining the changesin threshold voltage for memory cells at the first data state includesdetermining a change in threshold voltage of memory cells for the firstdata state at an intersection with an adjacent data state using acontroller in a memory device.
 7. A method for operating an array ofmemory cells, comprising: determining changes in threshold voltage formemory cells programmed to each data state of a first number of datastates by searching threshold voltage data of memory cells programmed tothe first number of data states having threshold voltages within a firstrange of threshold voltages; and shifting a second range of thresholdvoltages used to search threshold voltage data when determining changesin threshold voltage for memory cells programmed to each data state of asecond number of data states, wherein the second range is shifted from aprevious range based on the changes in threshold voltage for memorycells programmed to each data state of the first number of data states,wherein the first number of data states are different than the secondnumber of data states.
 8. The method of claim 7, including determiningchanges in threshold voltage for memory cells programmed to the secondnumber of data states by searching a memory device for threshold voltagedata of memory cells programmed to each data state of the second numberof data states within the second range of threshold voltages.
 9. Themethod of claim 8, including shifting sensing signals associated witheach data state of the second number of data states based on the changesin threshold voltage for memory cells programmed to each data state ofthe first number of data states.
 10. The method of claim 8, whereindetermining changes in threshold voltage for memory cells at each of thefirst number of data states determines the change in average thresholdvoltage using a controller in a memory device.
 11. The method of claim8, wherein determining the changes in threshold voltage for memory cellsprogrammed to each data state of the first number of data statesdetermines the change in threshold voltage of memory cells where eachdata state of the first number of data states intersects with anadjacent data state.
 12. The method of claim 8, wherein the first numberof data states includes a first and a second data state and the secondnumber of data states includes a third and a fourth data state.
 13. Themethod of claim 8, including determining changes in threshold voltagefor memory cells programmed to each data state of a first number of datastates by searching a memory device for threshold voltage data of memorycells programmed to each data state of the first number of data stateswithin a third range of threshold voltages that is shifted from thesecond range based on the changes in threshold voltage for memory cellsprogrammed to the first and second number of data states.
 14. The methodof claim 13, wherein the first number of data states includes a second,a third, and a fourth data state; the second number of data statesincludes a fifth, a sixth, and seventh data state; and the third numberof data states includes an eighth and a ninth data state.
 15. The methodof claim 13, wherein the first number of data states includes a second,a third, a fourth, and fifth data state; the second number of datastates includes a sixth and seventh data state; and the third number ofdata states includes an eighth and ninth data state.
 16. An apparatus,comprising: an array of memory cells; and a controller operably coupledto the array and configured to: search threshold voltage data of memorycells programmed to a first number of data states having thresholdvoltages within a first range of threshold voltages to determine changesbetween a first time period and a second time period in thresholdvoltage of memory cells programmed to the first number of data states;and search threshold voltage data of memory cells programmed to a secondnumber of data states having threshold voltages within a second range ofthreshold voltages that is shifted from a previous range based onchanges in threshold voltage of memory cells programmed to the firstnumber of data states to determine changes in threshold voltage formemory cells programmed to the second number of data states, wherein thefirst number of data states is different than the second number of datastates.
 17. The apparatus of claim 16, wherein the second range isshifted based on a linear extrapolation of the changes in thresholdvoltage for memory cells at each of the first number of data states. 18.The apparatus of claim 16, wherein the second range is shifted based onan average change of the changes in threshold voltage for memory cellsat each of the first number of data states.
 19. The apparatus of claim16, wherein the second range is shifted based on a table indicating thechanges in threshold voltage for memory cells at each of the firstnumber of data state.
 20. The apparatus of claim 16, wherein thecontroller is configured to shift sensing signals for memory cellsprogrammed to the second number of data states based on the determinedchanges in threshold voltage for memory cells programmed to the secondnumber of data state.